WebDiodes Incorporated Discrete and Analog Semiconductors Qualification Report – PCN-2212 Manufacturer No.: Conversion to Automatic Wafer Singulation Process for Selected TVS Products Revision: 0 Date: March 11, 2016 Qualified By: Diodes Incorporated Also Applicable To: The part numbers listed in the associated PCN are Qualified by Similarity (QBS) to the … Webwafer bump site. Bumped wafers are used in the assembly of FCBGA packages. The existing qualified wafer bumping site is Powertech Technology Inc. Singapore (PTI-SG). The transfer of bumping to PTI-TW is motivated by PTI-SG’s announcement to shut down all manufacturing operations at the end of 2024, as previously announced in advance PCN
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GlobalWafers Co. Ltd. - MarketWatch
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